SuperSpeed USB Developers Conference Presentations

Presentations for the SuperSpeed USB Developers Conference in Taipei, Taiwan on April 1-2, 2010 are posted below.

Thursday, April 1

SuperSpeed USB Keynote - Jeff Ravencraft, Intel Corporation
                                          Lee Atkinson, Hewlett-Packard
                                          Toby Chen, ASUSTek Computer Inc.
                                          Henry Kao, GIGABYTE

SuperSpeed USB Architecture Overview - Bob Dunstan, Intel Corporation

USB 3.0 Update: ECN/Errata - Rahman Ismail, Intel Corporation

USB 3.0 Layout & Routing: Front Panel Design - Howard Heck, Intel Corporation

SuperSpeed USB Hubs - Dan Froelich, Intel Corporation

Friday, April 2

Developing a SuperSpeed USB Device - Saleem Mohammad, Synopsys

SuperSpeed USB Physical Layer - Howard Heck, Intel Corporation

SuperSpeed USB Link Layer - Bob Dunstan, Intel Corporation

SuperSpeed USB UASP - Curtis Stevens, Western Digital

SuperSpeed USB Compliance: Electrical - Dan Froelich, Intel Corporation

SuperSpeed USB Compliance: Overview - Rahman Ismail, Intel Corporation