SuperSpeed USBWireless USBOriginal USBHi-Speed USBOn-The-Go USBHi-Speed On-The-Go USB gray vertical line Express Card
Home > Developers > SuperSpeed USB > SuperSpeed USB PIL

SuperSpeed USB Platform Interoperability Lab
Hosted by Intel Corporation

The SuperSpeed USB Platform Integration Lab (PIL) is available for assistance with SuperSpeed product development. The lab is open for USB-IF members only.  USB-IF members who wish to utilize the SuperSpeed USB Platform Interoperability Lab must complete the SuperSpeed USB PIL Lab Visit Request Form and submit it to admin@usb.org.

To test the interoperability of devices and hosts submitted to the PIL, the lab will use a variety of certified SuperSpeed USB hosts and devices. 

Testing will be completed per the following USB 3.0 Product Test Matrix.

SuperSpeed USB 2.0 Testing Requirement

Due to increased demand for SuperSpeed USB product certification, the PIL lab is reducing test days needed to complete USB 3.0 certification.  To achieve this goal, all SuperSpeed peripherals and end user hosts/hubs that are based on certified silicon are  required to complete USB 2.0 compliance tests at an authorized test lab.   

SuperSpeed products must satisfactorily complete all required USB 2.0 compliance tests:

• Interoperability
• Device Framework Tests (chapter 9)
• Device Class Framework Tests (if applicable)
• Average current
• Backvoltage
• Inrush
• Signal quality
• If high-speed signaling is supported, all packet parameter tests.

Please contact the authorized test lab of your choice directly to inquire about pricing and testing time.

Motherboard or system submissions must include a Windows 7 bootable hard disk with drivers for that system already installed. This will be returned once the lab has finished their testing.

To plan a visit to the SuperSpeed USB Platform Interoperability Lab hosted by Intel Corporation, return the completed SuperSpeed USB Platform Interoperability Lab Visit Request Form to admin@usb.org.