Document Library

LEGAL DISCLAIMER
THESE SPECIFICATIONS ARE PROVIDED “AS IS” AND WITHOUT ANY WARRANTY OF ANY KIND, EXPRESSED OR IMPLIED. WITHOUT LIMITATION, THERE IS NO WARRANTY OF NON-INFRINGEMENT, NO WARRANTY OF MERCHANTABILITY, AND NO WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE. ALL WARRANTIES ARE EXPRESSLY DISCLAIMED. USER ASSUMES THE FULL RISK OF USING THESE SPECIFICATIONS. IN NO EVENT SHALL USB-IF OR THE USB 3.0 PROMOTERS BE LIABLE FOR ANY ACTUAL, DIRECT, INDIRECT, PUNITIVE, OR CONSEQUENTIAL DAMAGES ARISING FROM SUCH USE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Title Category Type Technology Date
USB_PS_Interface_V1_00_20140414.pdf753.03 KBUSB PS Interface White Paper
  • USB PS Interface White Paper
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White Paper
power_delivery_motherboards.pdf627.53 KBPower Delivery Design Issues for Hi-Speed USB on Motherboards
  • Power Delivery Design Issues for Hi-Speed USB on Motherboards
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White Paper USB Power Delivery
usbmon10.pdf91.27 KBMonitor Control Class 1.0
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Specification
usb_20g.pdf150.03 KBAn Introduction to Hi-Speed USB
  • An Introduction to Hi-Speed USB
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White Paper
usbwire.pdf22.37 KBAn Analysis of Wireless Device Implementations on USB
  • An Analysis of Wireless Device Implementations on USB
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White Paper
pos1_02.pdf307.86 KBHID Point of Sale Usage Tables 1.02
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USB_2_0_Adopters_Agreement_final_021411.pdf26.48 KBUSB 2.0 Adopters Agreement
  • USB 2.0 Adopters Agreement
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Legal
crcdes.pdf15.16 KBCyclic Redundancy Checks in USB
  • Cyclic Redundancy Checks in USB
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White Paper
oaaddataformatsv6.pdf76.69 KBOAAD Arcade Usage Table
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Specification
USB_OTG_v2.0_Amendment_final_052609.pdf12.24 KBUSB 2.0 On-The-Go Specification Supplement Adopters Agreement
  • USB 2.0 On-The-Go Specification Supplement Adopters Agreement
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Legal
alsbuf.pdf343.91 KBDesign Guide for a low speed buffer for USB
  • Design Guide for a low speed buffer for USB
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White Paper
usbwire.pdf22.37 KBAn Analysis of Wireless Device Implementations on Universal Serial Bus
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White Paper
USB_Low_Voltage_InterChip_Amendment_final_20060320.pdf11.2 KBLow Voltage Inter-Chip Adopters Agreement Amendment
  • Low Voltage Inter-Chip Adopters Agreement Amendment
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Legal
siewp.pdf40.16 KBDesigning a Robust USB Serial Interface Engine (SIE)
  • Designing a Robust USB Serial Interface Engine (SIE)
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White Paper
hidpar.pdf89.52 KBHID Parser Error Checking
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White Paper
superspeed_inter-chip_supplement_1_02_19may2014.pdf609.62 KBInter-Chip Supplement to the USB Revision 3.0 Specification, Revision 1.02
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Specification
High_Speed_Inter-Chip_Amendment_20121129.pdf67.92 KBHigh-Speed Inter-Chip Adopters Agreement Amendment
  • High-Speed Inter-Chip Adopters Agreement Amendment
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Legal
USB3p1_Front_Panel_CabCon_Implment_Doc_Rev1p1.pdf2.87 MBUSB 3.1/USB Type-C(TM) Desktop Front Panel Cable and Connector Implementation Document
  • USB 3.1/USB Type-C(TM) Desktop Front Panel Cable and Connector Implementation Document
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White Paper
irp_mn.pdf89.29 KBHandling The IRP_MN_START_DEVICE PnP IRP v.1.0
  • Handling The IRP_MN_START_DEVICE PnP IRP v.1.0
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White Paper
hidpar.pdf89.52 KBHID Parser Error Checking
  • HID Parser Error Checking
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White Paper
USB_3_0_Adopters_Agreement_Mail_Stop_Update_20150622.pdf146.59 KBUSB 3.0 Adopters Agreement
  • USB 3.0 Adopters Agreement
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Legal
Establishing_USB_SuperSpeed_Gen2_Channel_and_Cable_Assembly_High_Speed_C....pdf1.61 MBMethodology Used to Determine SuperSpeed USB 10 Gbps (USB 3.1) - Gen2 Channel and Cable Assembly High Speed Compliance
  • Methodology Used to Determine SuperSpeed USB 10 Gbps (USB 3.1) - Gen2 Channel and Cable Assembly High Speed Compliance
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White Paper
remedia_vs_direct.pdf44.42 KBOn-Board USB connections for Digital Media Devices vs. Removable Media and Readers
  • On-Board USB connections for Digital Media Devices vs. Removable Media and Readers
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White Paper
usb_otg_and_eh_3-0_release_1_1_10may2012.pdf591.63 KBOn-The-Go and Embedded Host Supplement to the USB Revision 3.0 Specification, Revision 1.1
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Specification
Propagation_Delay_between_Host_Transcievers_and_Downstream_Ports.pdf602.1 KBPropagation Delay between Host Transceivers and Downstream Ports
  • Propagation Delay between Host Transceivers and Downstream Ports
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White Paper
stif.pdf216.93 KBSystem Test Implementers Forum
  • System Test Implementers Forum
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White Paper
USB_3.1_Loss_Budget_Rev_1.0_-_2015-03-02.pdf340.52 KBUSB 3.1 Channel Loss Budgets
  • USB 3.1 Channel Loss Budgets
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White Paper
wdm_pm11.pdf166.25 KBUnderstanding WDM Power Management v1.1
  • Understanding WDM Power Management v1.1
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White Paper
USB31_Embedding_Files_12222016.zip1.61 MBUSB 3.1 Reference Channel Models
  • USB 3.1 Reference Channel Models
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White Paper
white-4c.pdf23.16 KBUSB - APM Interactions
  • USB - APM Interactions
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White Paper
usb_32_20180912.zip19.92 MBThe USB 3.2 Specification released on September 22, 2017 and ECNs
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Specification USB 3.2
327216.pdf990.44 KBUSB 3.0 Radio Frequency Interference Impact on 2.4 GHz Wireless Devices
  • USB 3.0 Radio Frequency Interference Impact on 2.4 GHz Wireless Devices
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White Paper
usb-port_controller_specification_rev2.0_v1.0_0.pdf3.38 MBUSB Type-C(TM) Port Controller Interface Specification
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Specification USB Type-C
bwpaper2.pdf59.05 KBUSB Bandwidth Analysis
  • USB Bandwidth Analysis
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White Paper
usb_authentication_20180904.zip4.18 MBUSB Authentication Specification Rev. 1.0 with ECN and Errata through July 24, 2017
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Specification
Included in USB 3.1 zip file0 bytesUSB 3.1 Device Class Specification for Debug Devices
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Specification
USB_Superspeed_Equalizer_Design_Guidelines_2011-06-10.pdf1.57 MBUSB 3.0 SuperSpeed Equalizer Design Guidelines
  • USB 3.0 SuperSpeed Equalizer Design Guidelines
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White Paper
pd_fw_update_specification_rev_1_0_20160915b.pdf1.9 MBUSB Power Delivery Firmware Update Specification
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Specification USB Power Delivery
usblat3.pdf52.35 KBUSB Latency Requirements and the Effect of Video Adapter PCI Retry Condition on Maintaining USB Streaming Pipelines
  • USB Latency Requirements and the Effect of Video Adapter PCI Retry Condition on Maintaining USB Streaming Pipelines
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White Paper
usb_20_20181210.zip14.23 MBUSB 2.0 Specification
  1. The Original USB 2.0 specification released on April 27, 2000
  2. USB 2.0 Adopters Agreement
  3. Errata to the USB 2.0 specification as of December 7, 2000
  4. Mini-B connector Engineering Change Notice to the USB 2.0 specification
  5. Pull-up/pull-down Resistors Engineering Change Notice to the USB 2.0 specification
  6. Errata to the USB 2.0 specification as of May 28, 2002
  7. Interface Association Descriptor Engineering Change Notice to the USB 2.0 specification
  8. Rounded Chamfer Engineering Change Notice to the USB 2.0 specification as of October 8, 2003
  9. Unicode Engineering Change Notice to the USB 2.0 specification as of February 21, 2005
  10. Inter-Chip USB Supplement Revision 1.0 as of March 13, 2006
  11. Micro-USB Cables and Connectors Specification Revision 1.01 as of April 4, 2007 and corresponding Adopters Agreement
  12. USB 2.0 Link Power Management Addendum Engineering Change Notice to the USB 2.0 specification as of July 16, 2007
  13. High-Speed Inter-Chip USB Electrical Specification Revision 1.0 as of September 23, 2007
  14. Suspend Current Limit Changes Engineering Change Notice to the USB 2.0 Specification as of April 9, 2008
  15. 5V Short Circuit Withstand Requirement Change Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
  16. Device Capacitance Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
  17. Material Change Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
  18. USB 2.0 Phase-locked SOFs Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
  19. Micro-USB Micro-B ID Pin Resistance and Tolerance stack-up between D+ and D- Engineering Change Notice to the MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 as of December 22, 2008
  20. Quad Type Cable Additional for Micro USB ECN as of December 29, 2009
  21. Clarification on the Chamfer on USB 2.0 Micro Connectors ECN as of March 23, 2010
  22. Maximum Unmating Force Value Definition to USB 2.0 Micro Connectors ECN as of March 23, 2010
  23. "On-The-Go Supplement to the USB 2.0 Specification" Adopters Agreement
  24. USB TEST_MODE Selector Values ECN as of July 26, 2010
  25. Errata for USB 2.0 ECN:  Link Power Management (LPM) - 7/2007 as of October 11, 2011
  26. On-The-Go and Embedded Host Supplement to the USB Revision 2.0 Specification, Revision 2.0 version 1.1a as of July 27, 2012
  27. HSIC ECN as of May 21, 2012
  28. USB 2.0 Connect Timing ECN Update as of April 4, 2013
  29. HSIC Disconnect Supplement ECN as of September 18, 2013
  30. USB 2.0 VBUS Max Limit ECN as of August 11, 2014
  31. Embedded USB2 (eUSB2) Physical Layer Supplement to the USB Revision 2.0 Specification dated August 1, 2014
  32. USB OTG EH ECN Maximum Vbus Voltage dated November 26, 2014
  33. USB 2.0 DC Resistance dated December 10, 2018
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Specification USB 2.0
USB_3_0_SuperSpeed_CDR_0p5_whitepaper.pdf552.34 KBUSB 3.0 CDR Model
  • USB 3.0 CDR Model
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White Paper
documents_archive8.75 KBMicro-USB Cables and Connectors v1.01 Spec and Adopters Agreement
  • Micro-USB Cables and Connectors v1.01 Spec
  • Adopters Agreement
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iadclasscode_r10.pdf51.22 KBUSB Interface Association Descriptor Device Class Code and Use Model
  • USB Interface Association Descriptor Device Class Code and Use Model
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White Paper
TechGuide_xHCI_SSUSB_PDK_Ver2.1.pdf782.28 KBUSB 3.1 Peripheral Development Kit:
USB 3.1 xHCI-based Certification Platform
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Tools USB 3.2
USB_3_0_e-Compliance_methodology_0p5_whitepaper.pdf348.19 KBUSB 3.0 Electrical Compliance Methodology
  • USB 3.0 Electrical Compliance Methodology
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White Paper
hut1_12v2.pdf949.63 KBHID Usage Tables 1.12
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Specification
Isolation_Electromagnetic_Compatibility_1_0.pdf199.59 KBElectrical Isolation and Improved Electromagnetic Compatibility for Personal Healthcare Devices using USB
  • Electrical Isolation and Improved Electromagnetic Compatibility for Personal Healthcare Devices using USB
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White Paper
USB Power Delivery 20181203.zip37.34 MBUSB Power Delivery
  1. USB Power Delivery Specification Rev. 2.0, Version 1.3 and corresponding Adopters Agreement
  2. USB Power Delivery Specification Rev. 3.0, Version 1.2, June 21, 2018 and ECNs
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Specification USB Power Delivery
USB_3_0_Jitter_Budgeting_0p5_whitepaper.pdf347.16 KBUSB 3.0 Jitter Budgeting
  • USB 3.0 Jitter Budgeting
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White Paper
pid1_01.pdf127.53 KBDevice Class Definition for PID 1.0
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